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Course number and title: EECM250A Introduction to Micromachining and Microelectromechanical Systems (MEMS)
Credits: 4
Instructor(s)-in-charge: R. Candler (
Course type: Lecture
Required or Elective: Elective
Course Schedule:
Lecture: 4 hrs/week. Meets twice weekly.
Dicussion: 1 hr/week. Meets once weekly.
Outside Study: 7 hrs/week.
Office Hours: 2 hrs/week by instructor.
Course Assessment:
Homework: 9 assignments.
Exams: 1 midterm and 1 final.
Grading Policy: Typically 25% homework, 30% midterm, 45% final.
Course Prerequisites: College-level physics (Physics 1A, 1B, 4AL, 4BL, and 1C or EE 1) and chemistry (Chemistry 20A, 20L).
Catalog Description: Methods of micromachining and how these methods can be used to produce a variety of MEMS, including microstructures, microsensors, and microactuators. Process flows. Scaling properties. Chemical safety. Wafer cleaning. Chip yield. Mask making and layout. Photolithography. Wet etching. Dry etching. Vacuum systems. Physical vapor deposition. Chemical vapor deposition. Thermal deposition. Ion implantation. Electrodeposition. Structured Approach to the Design of Experiments (DOE) for Process Optimization. Students design microfabrication processes capable of achieving desired MEMS devices.  
Textbook and any related course material:
J. W. Judy, Lecture Notes for Introduction to Micromachining and MEMS.
J. W. Judy, Reading Assignments for Introduction to Micromachining and MEMS.
J. W. Judy, Reference Papers for Introduction to Micromachining and MEMS.
Course Website
Additional Course Website
Topics covered in the course:
Process flows.
Scaling properties, chemical safety, chip yield, cleanroom technology, wafer cleaning.
Mask making and photolithography.
Wet etching.
Vacuum systems and dry etching.
Physical vapor deposition and sputtering.
Thermal oxidation, diffusion, and ion implantation.
Chemical vapor deposition and electrodeposition.
Structured approach to the design of experiments for process optimization and process integration.
Will this course involve computer assignments? NO Will this course have TA(s) when it is offered? YES

:: Last modified: September 2011 by C. Chiuco ::

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