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Course number and title: EECM250L Introduction to Micromachining and Microelectromechanical Systems (MEMS) Laboratory
Credits: 2
Instructor(s)-in-charge: R. Candler (
Course type: Laboratory
Required or Elective: Elective
Course Schedule:
Lecture: 1 hr/week. Meets once weekly.
Lab: 4 hrs/week. Meetings once weekly.
Office Hours: 1 hr/week by instructor.
Course Assessment:
Quizzes: 10 quizzes
Labs: 2 laboratory reports
Exams: 1 final
Grading Policy: Typically 30% quizzes, 20% lab report 1, 20% lab report 2, 30% final.
Course Prerequisites: College-level physics (Physics 1A, 1B, 4AL, 4BL, and 1C or EE 1, ) and chemistry (Chemistry 20A, 20L).
Catalog Description: Practical hands-on experience with methods of micromachining and how these methods can be used to produce a variety of MEMS, including microstructures, microsensors, and microactuators. Process flows. Chemical safety. Wafer cleaning. Chip yield. Mask making and layout. Photolithography. Wet etching. Dry etching. Vacuum systems. Physical-vapor deposition. Chemical-vapor deposition. Thermal deposition. Ion implantation. Electrodeposition. Students work in small teams to produce wafers with many different MEMS as well as to characterize their performance.  
Textbook and any related course material:
J. W. Judy, Lecture Notes for Introduction to Micromachining and MEMS Laboratory.
J. W. Judy, Introduction to Micromachining and MEMS Laboratory Manual.
J. W. Judy, Reference Papers for Introduction to Micromachining and MEMS Laboratory.
Course Website
Additional Course Website
Topics covered in the course:
Alignment, front-backside alignment.
Dry etching.
Physical vapor deposition, e-beam evaporation, lift off.
Anisotropic and isotropic wet etching and release etching.
Device testing.
Will this course involve computer assignments? NO Will this course have TA(s) when it is offered? NO

:: Last modified: September 2011 by C. Chiuco ::

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